Introducing Kayaku Advanced Materials Updated SU-8 Material Portfolio

We understand that choosing the right materials is critical to the success of your device. Especially if you’ve been working with older formulations, it can be a challenge to map your needs to the latest options. That’s why we have made selecting the ideal material easier than ever by updating and streamlining our SU-8 material portfolio.

This guide provides a quick reference to our current, high-performance SU-8 options, all designed to ensure strong and consistent results across a wide range of film thicknesses.

Your Quick Guide to the SU-8 Portfolio (Click one to learn more)

Meet the Materials: A Closer Look

SU-8 TF 6000

Product Description:

SU-8 TF 6000 is a high-performance, negative-tone, epoxy-based photoresist optimized for creating thin, exceptionally uniform films. It utilizes chemical amplification and offers high contrast for excellent pattern fidelity. Sensitive to broadband UV light (i-, h-, and g-Line), SU-8 TF 6000 is the ideal choice for applications demanding high resolution, photo imageable, and permanent thin structures. Available in five standard viscosities, this photoresist can achieve low-defect coatings with film thicknesses ranging from 0.4 to 10 µm in a single spin-coating process. 

Key Features:

• Optimized for thin films coatings with high resolution when compared to standard SU-8
• Broadband, i-Line, g-Line and h-Line sensitivity
• Low temperature cure (<150°C)
• Good adhesion to both rigid and flexible substrates
• Improved film uniformity of <2%
• High thermal and chemical resistance
• Solvent-based development
• Available in 5 different viscosities

Adhesion Properties:

SU-8 3000

Product Description:

SU-8 3000 is an upgraded, high-contrast, negative epoxy photoresist for micromachining thick, permanent structures (2 to 50 µm). It offers enhanced adhesion and reduced stress compared to traditional SU-8. Ideal for creating high-aspect-ratio features (over 5:1) with near-vertical sidewalls, SU-8 3000 provides excellent chemical and thermal stability for permanent applications.

Key Features:

• Improved adhesion compared to SU-8
• Reduced coating stress compared to SU-8
• High aspect ratio > 5:1 imaging
• Vertical sidewalls
• Excellent dry etch resistance
• Solvent-based development

Adhesion Properties:

Note: Adhesion properties were collected on 100 x 100 μm features with 20 μm film thickness. Adhesion will differ based on feature size, dilution, and thickness.

SU-8 XFT

Product Description:

SU-8 XFT is a specialized, high-contrast, negative epoxy photoresist designed for ultra-thick films (50 µm to > 200 µm in a single coat). It offers improved adhesion and lower coating stresses while maintaining the ability to produce high-aspect-ratio structures (over 5:1) with near-vertical sidewalls and excellent chemical/thermal stability. 

Key Features:

• High aspect ratio imaging of ultra-thick structures
• Vertical sidewalls
• i-line (365 nm) and broadband processing
• Improved adhesion
• Reduced coating stress
• 50 to > 200 µm film thickness in a single coat

Adhesion Properties:

SU-8 3000CF DFR (Dry Film Resist)

Product Description:

The SU-8 3000CF DFR Series is a photosensitive, permanent, negative dry film resist utilizing a low-halogen, antimony-free epoxy for highly stable structures (e.g., SAW/BAW support walls, MEMS).

• SU-8 DFR is a high-performance, epoxy-based dry film photoresist engineered for thick, high-aspect-ratio microstructures with excellent mechanical strength and chemical resistance.
• Its lamination-based application provides uniform thickness control, reduced processing variability, and greater scalability for wafer-level and panel-level manufacturing.
• SU-8 DFR delivers superior sidewall quality, low stress, and strong adhesion, making it ideal for MEMS, microfluidics, wafer-level packaging, and advanced lithography workflows.
• Available in a range of thicknesses, SU-8 DFR offers process flexibility for customers looking to improve yield, throughput, and device performance in high-volume production environments.

Key Features:

• Antimony-Free
• Low Halogen (Total Chlorine < 900 ppm)
• Excellent Resolution and Aspect Ratio (>3:1)
• Excellent Thermal Stability
• Low Process Temperature
• Low Water Absorption
• Proven Reliability with No Delamination or Corrosion after HAST: 85°C / 85% RH 168 hr

Ensure Precision in Every Layer

Film thickness, adhesion strength, and aspect ratio are critical parameters that directly impact device performance and yield. Our SU-8 portfolio delivers controlled coating uniformity (<2%), adhesion up to 85 MPa on SiO₂, and proven thermal stability for permanent microstructures. Whether you require sub-10 µm thin films or ultra-thick coatings exceeding 200 µm, each formulation is engineered for predictable, repeatable results across diverse substrates and processes.

Get the Information You Need to Make the Right Choice

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