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Introducing Kayaku Advanced Materials Updated SU-8 Material Portfolio
We understand that choosing the right materials is critical to the success of your device. Especially if you’ve been working with older formulations, it can be a challenge to map your needs to the latest options. That’s why we have made selecting the ideal material easier than ever by updating and streamlining our SU-8 material portfolio.
This guide provides a quick reference to our current, high-performance SU-8 options, all designed to ensure strong and consistent results across a wide range of film thicknesses.
Your Quick Guide to the SU-8 Portfolio (Click one to learn more)
| Product | Single-Coat µm Range | Application Focus |
| SU-8 TF 6000 | < 10 | High-resolution, thin films (Thinner replacement of SU-8 2000) |
|
10 - 50 |
Standard, mid-range films |
|
|
50 – 200 |
High-aspect-ratio, thick films |
|
|
20, 30, 45 |
Lamination and dry-film needs (multiple options available), highly uniform. |
Meet the Materials: A Closer Look
SU-8 TF 6000
Product Description:
SU-8 TF 6000 is a high-performance, negative-tone, epoxy-based photoresist optimized for creating thin, exceptionally uniform films. It utilizes chemical amplification and offers high contrast for excellent pattern fidelity. Sensitive to broadband UV light (i-, h-, and g-Line), SU-8 TF 6000 is the ideal choice for applications demanding high resolution, photo imageable, and permanent thin structures. Available in five standard viscosities, this photoresist can achieve low-defect coatings with film thicknesses ranging from 0.4 to 10 µm in a single spin-coating process.
Key Features:
- Optimized for thin films coatings with high resolution when compared to standard SU-8
- Broadband, i-Line, g-Line and h-Line sensitivity
- Low temperature cure (<150°C)
- Good adhesion to both rigid and flexible substrates
- Improved film uniformity of <2%
- High thermal and chemical resistance
- Solvent-based development
- Available in 5 different viscosities
Adhesion Properties:
| Substrate | Adhesion Strength (MPa) |
| Si | 58 |
| SiN | 59 |
| SiO2 | 58 |
| Cu | 25 |
| Glass | 48 |
Note: Adhesion properties were collected on 100 x 200 μm features. Adhesion will differ based on feature size, dilution, and thickness.
SU-8 3000
Product Description:
SU-8 3000 is an upgraded, high-contrast, negative epoxy photoresist for micromachining thick, permanent structures (2 to 50 µm). It offers enhanced adhesion and reduced stress compared to traditional SU-8. Ideal for creating high-aspect-ratio features (over 5:1) with near-vertical sidewalls, SU-8 3000 provides excellent chemical and thermal stability for permanent applications.
Key Features:
- Improved adhesion compared to SU-8
- Reduced coating stress compared to SU-8
- High aspect ratio > 5:1 imaging
- Vertical sidewalls
- Excellent dry etch resistance
- Solvent-based development
Adhesion Properties:
| Substrate | Adhesion Strength (MPa) |
| Si | 56 |
| SiN | 59 |
| SiO2 | 48 |
| Cu | 56 |
| Glass | 35 |
Note: Adhesion properties were collected on 100 x 100 μm features with 20 μm film thickness. Adhesion will differ based on feature size, dilution, and thickness.
SU-8 XFT
Product Description:
SU-8 XFT is a specialized, high-contrast, negative epoxy photoresist designed for ultra-thick films (50 µm to > 200 µm in a single coat). It offers improved adhesion and lower coating stresses while maintaining the ability to produce high-aspect-ratio structures (over 5:1) with near-vertical sidewalls and excellent chemical/thermal stability.
Key Features:
- High aspect ratio imaging of ultra-thick structures
- Vertical sidewalls
- i-line (365 nm) and broadband processing
- Improved adhesion
- Reduced coating stress
- 50 to > 200 µm film thickness in a single coat
Adhesion Properties:
| Substrate | Adhesion Strength (MPa) |
| Si | 83 |
| SiN | 83.44 |
| SiO2 | 85.16 |
| Cu | 78.57 |
| Soda Lime | 54.38 |
SU-8 3000CF DFR (Dry Film Resist)
Product Description:
The SU-8 3000CF DFR Series is a photosensitive, permanent, negative dry film resist utilizing a low-halogen, antimony-free epoxy for highly stable structures (e.g., SAW/BAW support walls, MEMS).
- SU-8 DFR is a high-performance, epoxy-based dry film photoresist engineered for thick, high-aspect-ratio microstructures with excellent mechanical strength and chemical resistance.
- Its lamination-based application provides uniform thickness control, reduced processing variability, and greater scalability for wafer-level and panel-level manufacturing.
- SU-8 DFR delivers superior sidewall quality, low stress, and strong adhesion, making it ideal for MEMS, microfluidics, wafer-level packaging, and advanced lithography workflows.
- Available in a range of thicknesses, SU-8 DFR offers process flexibility for customers looking to improve yield, throughput, and device performance in high-volume production environments.
Key Features:
- Antimony-Free
- Low Halogen (Total Chlorine < 900 ppm)
- Excellent Resolution and Aspect Ratio (>3:1)
- Excellent Thermal Stability
- Low Process Temperature
- Low Water Absorption
- Proven Reliability with No Delamination or Corrosion after HAST: 85°C / 85% RH 168 hr
Ensure Precision in Every Layer
Film thickness, adhesion strength, and aspect ratio are critical parameters that directly impact device performance and yield. Our SU-8 portfolio delivers controlled coating uniformity (<2%), adhesion up to 85 MPa on SiO2, and proven thermal stability for permanent microstructures. Whether you require sub-10 µm thin films or ultra-thick coatings exceeding 200 µm, each formulation is engineered for predictable, repeatable results across diverse substrates and processes.
Get the Information You Need to Make the Right Choice
Click the button below and fill out the form to contact our technical development team with any technical questions, specifications, guidelines, or seeking recommendations. Optimize your workflow with confidence.